Molecular analysis of additives and impurities accumulated on copper electrodeposited layer by Time-of-Flight Secondary Ion Mass Spectrometry

Artykuł naukowy w czasopiśmie recenzowany

Czasopismo: APPLIED SURFACE SCIENCE (ISSN: 0169-4332)
Współautorzy: Robert Mroczka, Grzegorz Żukociński
Rok wydania: 2019
Tom: 463
Strony od-do: 412-426
DOI: 10.1016/j.apsusc.2018.08.238

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Cytowanie w formacie Bibtex:
@article{1,
author = "Rafał Łopucki and Robert Mroczka and Grzegorz Żukociński",
title = "Molecular analysis of additives and impurities accumulated on copper electrodeposited layer by Time-of-Flight Secondary Ion Mass Spectrometry",
journal = "APPLIED SURFACE SCIENCE",
year = "2019",
pages = "412-426"
}

Cytowanie w formacie APA:
Łopucki, R. and Robert Mroczka and Grzegorz Żukociński(2019). Molecular analysis of additives and impurities accumulated on copper electrodeposited layer by Time-of-Flight Secondary Ion Mass Spectrometry. APPLIED SURFACE SCIENCE, 412-426.